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Implementing Bluetooth Wireless Technology in End Products
Over the past few years Bluetooth technology has been greeted with great enthusiasm from a variety of companies who are keen to implement the technology into their end products. On the whole Bluetooth is meant to be simple and easy to implement have low power consumption and be relatively inexpensive. Currently in the market we are starting to see Bluetooth products (for example headsets for mobile phone applications Bluetooth enabled mobile phones and PDAs) from major names such as Ericsson Sony Toshiba and Motorola emerging rapidly to capture market attention. It is estimated that by the year 2005 Bluetooth wireless technology will be a built-in feature available for more than 600 million products worldwide.

It could be argued that there are three main ways to implement Bluetooth wireless technology into an end product. The first is by using a Bluetooth module. This is the easiest method to implement Bluetooth functionality into an end product. It offers the fastest time-to-market solution. However this is also a very expensive and inflexible method.

The second method is to use a pre-qualified Bluetooth chip set. These are readily available in the market for integration into the system level of the product and major names that offer chip sets include CSR Zeevo Philips and Infineon Technologies. The third method is to use a Bluetooth enabled Application Specific Integrated Circuit (ASIC).

Companies can achieve Bluetooth technical capability through in-house development or the licensing of Bluetooth Silicon Intellectual Property (IP). Currently Bluetooth solutions can be licensed as Intellectual Property (IP) from NewLogic Ericsson and ParthusCeva.